REL61™ and REL22™ lead-free solder alloys developed by AIM Solder have been specifically engineered as exceptionally durable alloys for extreme service environments. Extensive testing has shown these REL alloys to significantly reduce tin whisker formation as well as outperforming SAC alloys in thermal shock, vibration and drop shock resistance, making these alloys the ideal choice for all mission critical electronics applications. Available in bar solder, wire solder, solder paste.
REL61 is ideally suited for industries which require increased durability in thermal cycling performance such as LED lighting, in-cabin automotive electronics and high power applications. REL61 provides the electronics assembly marketplace a low cost alternative to SAC alloys that has the reliability and performance characteristics equal to or greater than SAC305 and other low/no-silver solder alloys.
REL22 has also been developed to address production and quality issues common to similar alloys including Sn/Ag/Bi/Sb/Ni/Cu, such as pin-holes on SMT solder joints and voiding on BTC components. Testing demonstrates that REL22 is well suited to extreme thermal exposure operating environments such as under-hood automotive, avionics/aerospace and other severe operating environments. The low creep rates exhibited by REL22 make it ideal for applications where thermal shock, vibration and high g-forces are experienced.