Techinno New Material Technologies Co.,Ltd.

Techinno Technology was founded in 2018 and acquired by Darbond in Dec 2024. We are dedicated to provide integrated thermal dissipation solutions from chips and system level, focus on developing, manufacturing and selling thermal interface material (TIM1.5&TIM2), composite liquid metal, PCB thermal pre-preg, devoted to be the pioneer and leader of high-performance electronic materials.