PacTech GmbH

Official Youtube Channel of PacTech - Packaging Technologies GmbH.

We provide Advanced Packaging Equipment for:
- Laser Assisted Bonding
- Laser Soldering
- Electroless Plating
- Solder Ball Mounting
- Wire Bonding
- Wafer Bumping
- SMT (Surface Mount Technology)
- Probe Card
- Flip Chip
- 3D-Package

We also offer customers services for Wafer Level Packaging:
- RDL (Redistribution Layer)
- Copper Pillar
- Electroless Plating
- Solder Bumping
- Wafer Level Component Assembly
- Wafer Thinning
- Wafer Metal Coating
- Wafer Dicing

http://www.pactech.com
© PacTech - PackagingTechnologies GmbH 2011. All Rights Reserved.