 The abstract discusses how the controllability of the microstructure of a compressed hierarchical building block is important for optimizing various performance parameters, including thermal management. It also explains how this can be achieved by tailoring dense, oriented, and interleaved structures from vertically aligned carbon nanotuborase, vacants, graphene films, GF, and other materials. These structures are then used to create compressed building blocks of OVAGF and SVAGF, which have different levels of orientation. The OVAGF has a denser and more ordered structure than the SVAGF, resulting in better thermal conductivity and cooling efficiency when used as a heat dissipation plate. This allows for a 144% increase in cooling efficiency over conventional Si3N4 for cooling high-power light emitting diodes. This article was authored by Lin Chiang Peng, Hu Tao Yu, Kanchin, and others.