 Looking for a technology able to bring high-definition, real-time, accurate 3D sensing into consumer devices? SG is proud to announce VD55H1 as the world's first 0.5 megapixel indirect time-of-flight depth sensor manufactured with stacked weight for technology. The VD55H1 enables high-resolution, long-distance, and power-efficient sensing of your environment in three dimensions and paves the way to next-generation augmented reality. The VD55H1 is ideal for a wide range of devices, like smartphones and tablets, augmented and virtual reality headsets, and consumer robots and any devices needing a perception of distance and 3D environment. The VD55H1 has advanced features aimed at 3D computer vision and imaging applications. Catching the details with 0.5 megapixel and depth precision of 0.1%, enabling room mapping with 5 meters ranging in full resolution. Making fine gesture tracking possible with fast capture sequence. Producing real-time distance map for better background blur and photography effects. VD55H1 is also a solution for secure face authentication even under bright sunlight, by enabling a highly accurate 3D modeling of the face. Manufactured using ST Advanced Stacked Wafer Technology, VD55H1 is a unique high-resolution, power-efficient, and small sensor die to adjust 3D cameras' challenges in consumer devices. It is part of the FlightSense family, with a proven track record of more than 1 billion time-of-flight sensors already on the market today.