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Metalica Sputter System

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Published on Sep 3, 2013

Metalica is a metal sputter deposition system that was built in-house to provide flexible processing options for non-CMOS compatible materials. The Metalica consists of four primary sub-systems: the bell jar process chamber to hold the targets and substrates, two independent magnetron S-gun sputter sources with their associated DC power supply, a vacuum system to evacuate the process chamber, and an argon mass-flow controller to regulate the process chamber environment.

For more information:
https://snf.stanford.edu/
http://nanolabs.stanford.edu/

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