 Good morning everybody. My name is Stefan Rosal and I'm the ST EMEA line manager for future electronics And we would like to welcome you on the future electronic booth at the embedded works 2022 Let's have a quick look around of what we have prepared to show the ST micro electronics technology now Let's go to to the to the power and I would like Our gentleman David Woodcock to introduce itself and to show the fantastic board We have done to let's say promote the GAN technology of ST. This is a full ST dedicated David, your stage. Thank you Stefan morning. If we could just to show you over here So this project we're calling GAN stuff Stefan was indicating it's a design collaboration between future electronics and ST micro electronics And it's focusing on the capability of reducing the size using GAN to reduce the size of power stages The board itself is indicated here So this is a DC to DC state. It's not a full AC to DC. It's half of an AC to DC if you like But it's a resonant LLC DC to DC running up to 500 watts The advantage in doing things this way by switching faster using GAN technology is to reduce the size And we reckon that with switching at around about 250 kilohertz at full load Compared with 70 kilohertz or 100 kilohertz with comparable silicon solutions You can get the size down by around 30% and that's what we're seeking to demonstrate with this design target applications Clearly where size and weight counts. So from our customer perspective then that might be in the telecom markets in robotics transport or industrial sectors So I've been hearing hearing about GAN a little bit for chargers Yes, people are like hyping it up as the new thing that really helps with power. Yes, and how does it help exactly? and The switching characteristics that the technology offers over silicon are more perfect if you like so You get fewer Losses when you are switching a voltage So that means over silicon you can switch faster And if you're able to switch faster then in a in any power system that allows you to start considering using smaller magnetic components smaller primary inductance for transformers And potentially smaller other passive components like capacitors. So that helps to reduce the overall size Or you can use the fact that the switching characteristics are less lossy to improve efficiency And that can also help you with size reduction for the overall system as well What does the ST part help in terms of realizing all this? The specific ST part that's Enabling this capability is a product called master GAN. It's actually a series of different products With different grades of capability, but fundamentally it's an integrated GAN device with a half bridge or two power switches Together with integrated drivers for those power switches on a single chip So it's a very very compact and very very small solution Nice