Raman spectroscopy used to analyse a silicon wafer

Renishaw plc
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Published on Jun 12, 2017

Renishaw’s LiveTrack™ focus-tracking technology makes it easy to study samples with uneven, curved, or rough surfaces. This 3D Raman image of an indented silicon wafer reveals stresses around the indent (compressive regions white/yellow, tensile regions black/dark red). The blue-green region within the indent is silicon that has been very highly plastically deformed, with a highly amorphous structure.

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