 So we're here at the ID Tech Act show and hi, so who are you? I'm Mario Grafel from Sensory and I'd like to show you our latest technology demonstrator. Yeah, so what is this? This universal sensing platform has a system in a package which can be attached on package with additional functionality, in that case it's a wireless charging function. This is very small. Yeah, this is quite small because it's a wafer level technology which we want to enable also for startups and also for small and medium enterprises. So you have these modules here? Yeah. So what are all these? Yeah, they are always consistent of the same module. This is a base module. And in the base module there's a powerful application processor and a Bluetooth low-energy RF functionality. There's also a 9-axis inertial sensor inside and DC-DC regulator. And everything you need is just a plug-in battery and then it will work. And you have the possibility additional to solder your own application on top of the package and so you get a very, very small and compact system from the first prototype. So what do you solder on? Your own application, what is that? Yeah, this is an example. This is done usually made by the customer but this is a sample for ambient sensing. These are a module with a gas sensor, with temperature, with humidity and pressure. All that? This could be an example of an air quality monitoring application. But the application itself comes completely from the customer. We just saw the system itself. So can I see all the logos that are on here? So I see a little, what are the logos? Yeah, this is from a former project which we commercialize now. So the logo is not very important at the moment here because it's not sensory. But this is from an older project which will be commercialized now in our product line because it's very good. But it says V-BAT? What is it? V-BAT? No, it's so small. This is just a battery connector point. These are so small. It's like you can only swallow it and you still find it, right? So what are the chips inside? Is it like an ARM processor? This is an ARM processor inside, in that case. ARM protects M0 plus? M0, in that case. But the new part which is still under development, the first prototypes will be ready in the middle of next year. There will be a very, very powerful RISC-5 core inside. So you're doing RISC-5? Can you hold it right here? Yes, of course. It's a complete owned development. How does that differ from the ARM Cortex-M0? It's much, much, much more powerful. It's a cluster core with nine cores inside running between 400 and 600 MHz. So it's ready for image processing, AI and other way, extensive sensor data fusion. How do you like the ARM Cortex-M4? More powerful. Or M7? Yeah, more like M7. I'm not so familiar with the ARM product line, but I think it will be much more powerful. Does it work? This is a dummy. This is still under construction. Is it here? Yes, the tape out will be very soon, the first tape out of this. High bandwidth internal bus? Yes. And 22 nanometer? Yes. What is the other one? Nanometer here. This is not a silicon fabrication, so we use a ready chip from Nordic in that case. And this is an owned development in 22 nanometer FDSOI technology from ground boundaries. Own development? Yes. This is under development. This is more inside. This is a little bit different. It's more a chip led because it's a combination of different chips. Inside there will be more or less only the RISC-5 core with some passives. And this RISC-5 core is a complete owned development. Absolutely. From the technology point of view. Is it a Frenhofer project? Yes. It's a Frenhofer project together with global foundries. But the Nordic semiconductor solution is very optimized, very low power. Yes, yes. They're pretty great, not to use. They're pretty great, but this has much more functionalities and power inside, especially security functionalities which we miss and the cluster core. All right. But there's also the ARM Cortex M33 or 23 that have security. Yes. But how is the security going to be different than this one? There's a complete security subsistence. You have a life cycle mentioned. You can store certifications and keys in one time programmable memory. And the device knows every time in which condition it is. If it's out of FAP, you have signed code on the boot loader and in special boot areas. You have a differentiation between the machine mode and the user mode like under Linux but in hardware. It's hardware separation. Yes. And isn't this year's away or is it very soon? It's very soon. Yes. It says tape out 2009. Yes. This year we'll be with the tape out and the complete package and products so as you can see it here, we'll be ready in the middle of next year. Did Frenhofer make chips before? Yes, of course. There are some institutes with dealing with silicon industry. Usually they don't use ARM chip. I think these are more, not all institutes develop application processors so sometimes they produce or they develop for example sensors like MAP sensors and so on. Sensors. But this is the first time that anybody at Frenhofer is making like a CPU? Not the first time I think. I don't know officially. But four more times I'm not sure if they use an ARM or if they didn't use an ARM. All right. And does the whole, with Global Foundries, they provide the whole tool set to make it work and very smooth? Yes. We want to provide it for, and usually if you are a big customer and you want to produce a product in five million or ten million pieces, then there's no problem to talk the Global Foundries and to apply a supply chain. But if you are a small company or a startup, then you have a problem and that gap we want to close. But how about the software is not compatible, right? In the project also... Is it different software? Yes, this is different software. Yes, that's true. But it's also GCC based. Like this one. This is an ARM compiler for sure. It's an RISC compiler, but it's also RISC GCC. So the tool chain is now also under development. Is it easy to recompile? Yes. You just click one button? Yes, that's it. And then... All right. Other projects that are similar out there, some companies are doing. And what will happen? Probably... Are you going to be selling the module or the, selling the IP? We're selling the module and also the software with the module comes with a module, yes, an SDK. Okay. And so how old is the company? Three months. Three months? Approximately, yes. So is it a spin-out of Fraunhofer or is it Fraunhofer? It's a more joint venture. Fraunhofer is one of the shareholders, some Fraunhofer institutes. But it's more or less a joint venture between Global Foundry, Fraunhofer and a third investor from Berlin. Next big thing. Next big thing? Yes. This is IoT. This is the size. Absolutely. Yeah, this is the size. And what's the price? This is structure. Yeah, that's a good question. But it could be compatible to solutions without sensors. So it should be a couple of euros. But does it do something that no other module can do? It could do maybe, but usually they don't do it for small and medium enterprises and startups in that constellation. We have the luck that we have this big development project which is running now and is funded by a little bit like from the government also. And this closes the gap for the development. And it says Ethernet time-sensitive networking. And can FD, it sounds like something for the cars or no? It's for industrial applications more. In that case, it's both connectivity. So can flexible data rate is often used in industrial area. And also Ethernet time-sensitive networking is quite new standard which is completely implemented in the device as an IP core. But here you have a different kind of module, some of Bluetooth. Yeah, all of them here have Bluetooth. This is a first starting point. This was a demonstrator, but maybe I think now to commercialize it also as a product. Thank you very much.