 Hi, I'm Jeff Halbig, Product Marketing Manager for ST Power Discretes in the Americas. Today I want to talk about the ST Power brand of innovative solutions combining our leading technology silicon and wide-band gap materials with new innovative packaging technologies to span the renewable energy, automotive and industrial markets. For lower-power motor control solutions, we have our slim, small low-loss intelligent molded module Intelligent Power Modules which can span power levels from 20 watts with the surface mount packaging all the way to 3 kilowatts with our dual inline package. These are serving many of our markets such as white goods and ceiling fan operation. As we need to move to higher powers, we move now to packaging that's innovative for higher power applications spanning up to 3 kilowatts to 20 kilowatts with our ACE pack, our Adaptable Compact Easier Package. These press-fit pin molded modules allow for any combination of ST silicon that you can imagine whether it be wide-band gap material or silicon carbide diodes, standard diodes or super-junction MOSFETs as well as the standard IGBTs which we all know are typically packaged in these devices today. Going beyond that, we want to offer our customers flexibility with not just press-fit technologies but now introducing the new ACE pack SMIT standing for Surface Mount Isolated Top Package. It allows a surface mount module with the same flexibility as the ACE packs and allows for even higher current densities up to 200 amps. Here at ST we know that today's designer needs lots of options in order to optimize their application. No one application is the same and you may have different cost constraints or performances that you're trying to achieve. So here we're demonstrating an electric vehicle traction inverter in three different topologies or styles of design. First we have a myriad of ST ACE pack SMITs, each housing an individual IGBT, using five in parallel, combined to make three phases of a traction inverter for a 100 kilowatt solution. This offers designers very ease of assembly in PC boards and also a low-cost solution for their manufacturing. As we move to more ease of manufacturing we have here the ACE pack drive solution which allows for the base plate to be assembled right onto a water-cooled chassis and for a control panel to be press-fit right on top for easily mechanically assembled solutions. Finally we have one of our most flexible and innovative solutions to date. This is taking advantage of the new ST pack which is a multi-centered die solution for wide-band gap materials and IGBTs for traction inverters and automotive. What this allows is for the center die internal to the device to the terminals to also be centered onto the water-cooled chassis. And this is not only giving more superb thermal performances but also the best in class reliability in thermal cycling which is crucial for automotive applications. And then finally we also want to introduce today that ST is entering the wide-band gap community with its first gallium nitride solution. In the middle of 2019 we'll introduce our first 120 milliohms 650 volt truly off HEMT GAN device for switch mode power supply application. Thank you.