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SURE2010: Development and Characterization of Inkjet Printing for Wafer Bonding...

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Uploaded on Sep 20, 2010

Development and Characterization of Inkjet Printing for Wafer Bonding and Sealing of Integrated Systems

Robust, low-temperature bonding and sealing methods are needed to package many micro electromechanical systems (MEMS) such as micro-pumps, gyroscopes, and pressure gauges. In this project, the student will work closely with graduate students to develop new sealing technologies for a miniature gas micro pump. Specifically, the student will use equipment in the Lurie Nanofabrication Facility to deposit sealant materials such as epoxies (glues) or other soft materials onto substrates such as silicon or glass using a specialized ink-jet printing machine, in order to bond two substrates together. S/he will be responsible for identifying appropriate sealants, developing the printing technique for each sealant, and assessing the impact of different substrate preparations. The student will test the effectiveness of the new sealing methods using a variety of tests including non-destructive inspection, bond shear strength measurement, leak/permeability testing, and thermal durability testing. Candidates should have some knowledge of electronic materials (e.g. semiconductors) or materials science. A background in micro-/nano-fabrication is preferred but not required.

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