 We developed a low-cost nanoparticle based laser patterning process for fabrication of flexible electronics using sintered copper and silver particles on paper and polyethylene terephthalate substrates which allows for selective deposition properties control of printed patterns and flexible substrate cutting. The thermal effects of the laser on film morphology were observed and the sensitivities of electrical properties with respect to porosities at different laser power densities were analyzed. The fabrications of strain sensor and kirigami electronics were demonstrated. This article was authored by Jihyon Song, Hojin Kim, Minitsa Kim and others.