 Chips have become smaller and faster. But now, the semiconductor industry faces pressure to increase compute power, manage complex supply chains, and decrease environmental impact. IBM Semiconductors is addressing these challenges. When something doesn't exist, we invent it. From the computers that powered the Apollo missions, to the groundbreaking chip technologies that run today's most advanced applications. Making a new chip can take thousands of steps. With sophisticated design software, we create a blueprint pinpointing the exact location of billions of transistors and their connecting wires. The blueprint is sent to our lab in Albany, New York, where we fabricate silicon wafers using the world's most advanced tools. Once a prototype is built, it's tested, revised, and tested again. It is then sent to our chip packaging facility in Bromont, Quebec, the largest in North America. IBM has continued to lead the world in semiconductor R&D breakthroughs, like vertical transistor devices. The world's first two nanometer node chip and the artificial intelligence unit. We are also developing design and enablement solutions, and creating intelligent fabrication labs powered by AI. By advancing semiconductor technology today, we are empowering the innovators of tomorrow. IBM is inventing what's next in semiconductors.