 This research has developed a new type of material that can be used in microelectronic packaging applications. It is composed of a vertically aligned silicon carbide nanowire slash boron nitride network embedded within a cellulose aerogel matrix. This combination of materials allows for high thermal conductivity in both the vertical and horizontal directions, as well as electromagnetic wave absorption properties. This article was authored by Duopan, Guoyang, Hala Mabodif, and others.