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Etch Processes for Microsystems - Part I

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Published on Feb 7, 2013

In this presentation we discuss the types of etch processes used to fabrication micro-sized devices with an emphasis on the wet etch processes. Part II of this series covers the dry etch processes. This presentation is presented by the Southwest Center for Microsystems Education (SCME). Supporting materials can be downloaded from the SCME website (http://scme-nm.org).

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  1. 5

    Breaking Silicon Wafers Activity - Demo

  2. 6

    Microcantilevers as Biosensors

  3. 7

    Cantilevers and Resonant Frequency

  4. 8

    An Introduction to DNA Microarrays

  5. 9

    DNA Microarray Fabrication

  6. 10

    How Does a DNA Microarray Work?

  7. 11

    Wet Oxidation Process

  8. 12

    Dry Thermal Oxidation Process

  9. 13

    Wet vs. Dry Oxidation Processes

  10. 14

    History of MEMS - An Introduction

  11. 15

    Weights and Measures Part III

  12. 16

    Weights and Measures Part II

  13. 17

    Weights and Measures Part I

  14. 18

    The Workings of the Retinal Prosthesis

  15. 19

    Silicon Crystal Origami

  16. 20

    MEMS Applications Overview

  17. 21

    Comparison of Scale: Macro, Micro, Nano

  18. 22

    Introduction To Transducers - Macro and Micro-size

  19. 23

    Introduction to Sensors - Macro and Micro-size

  20. 24

    Introduction to Actuators - Macro and Micro-size

  21. Etch Processes for Microsystems - Part I

  22. 26

    Etch Processes for Microsystems Fabrication - Part II

  23. 27

    Deposition Overview - Part I

  24. 28

    Deposition Overview - Part II

  25. 29

    Photolithography Overview for MEMS

  26. 30

    LIGA_Micromachining

  27. 31

    Surface Micromachining Overview

  28. 32

    Bulk Micromachining Overview

  29. 33

    MEMS Pressure Sensor Fabrication

  30. 34

    DNA Microarray

  31. 35

    DNA Hybridization

  32. 36

    Hydrophobic MP4.mov

  33. 37

    LIGA Micromachining Process Overview

  34. 38

    Ps_backside_etch_3loops.mov

  35. 39

    MEMS Pressure Sensor Operation

  36. 40

    (100) Crystal Plane of Silicon

  37. 41

    MEMS Cantilevers - Sacrificial Layer Removal

  38. 42

    MEMS Pressure Sensor Backside Etch

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