 Wafers are sawed out of cylinders of pure crystalline silicon, then polished to mirror-like finish. With lithography, we are able to print and ultimately etch billions of transistors onto a wafer with atomic precision. A high-energy laser fires on a microscopic droplet of molten tin and turns it into plasma, emitting extreme ultraviolet light, which then is focused into a beam. We reflect beam of a masked pattern that contains the complex design of the circuitry of the chip we want to print. That pattern of light is then shrunk through an array of atomically precise reflective mirrors, finally casting onto the silicon wafer at a microscopic level. This light exposure burns the pattern into the photoresist and after it is developed, it forms a relief pattern that can be used to etch the desired structures into the silicon. The wafer gets processed subsequently and cleaned to remove the resist. This process gets repeated layer after layer, as many as a hundred times. And over days and weeks, we get to ultimately create a fully functioning chip with transistor dimensions at a nanometer level.