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Deposition Overview - Part I

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Published on Sep 4, 2012

This is a brief overview of the deposition processes used to fabricate micro-sized devices. This presentation covers "what is deposition?", spin-in deposition, and thermal oxidation. Part II covers CVD, PVD, and electrodeposition. This presentation is presented by the Southwest Center for Microsystems Education (SCME). Supporting materials can be downloaded from the SCME website (http://scme-nm.org).

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  1. 7

    Microcantilevers as Biosensors

  2. 8

    An Introduction to DNA Microarrays

  3. 9

    DNA Microarray Fabrication

  4. 10

    How Does a DNA Microarray Work?

  5. 11

    Wet Oxidation Process

  6. 12

    Dry Thermal Oxidation Process

  7. 13

    Wet vs. Dry Oxidation Processes

  8. 14

    History of MEMS - An Introduction

  9. 15

    Weights and Measures Part III

  10. 16

    Weights and Measures Part II

  11. 17

    Weights and Measures Part I

  12. 18

    The Workings of the Retinal Prosthesis

  13. 19

    Silicon Crystal Origami

  14. 20

    MEMS Applications Overview

  15. 21

    Comparison of Scale: Macro, Micro, Nano

  16. 22

    Introduction To Transducers - Macro and Micro-size

  17. 23

    Introduction to Sensors - Macro and Micro-size

  18. 24

    Introduction to Actuators - Macro and Micro-size

  19. 25

    Etch Processes for Microsystems - Part I

  20. 26

    Etch Processes for Microsystems Fabrication - Part II

  21. Deposition Overview - Part I

  22. 28

    Deposition Overview - Part II

  23. 29

    Photolithography Overview for MEMS

  24. 30

    LIGA_Micromachining

  25. 31

    Surface Micromachining Overview

  26. 32

    Bulk Micromachining Overview

  27. 33

    MEMS Pressure Sensor Fabrication

  28. 34

    DNA Microarray

  29. 35

    DNA Hybridization

  30. 36

    Hydrophobic MP4.mov

  31. 37

    LIGA Micromachining Process Overview

  32. 38

    Ps_backside_etch_3loops.mov

  33. 39

    MEMS Pressure Sensor Operation

  34. 40

    (100) Crystal Plane of Silicon

  35. 41

    MEMS Cantilevers - Sacrificial Layer Removal

  36. 42

    MEMS Pressure Sensor Backside Etch

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