 ST has extended its portfolio of MOSFETs with the addition of the fully-molded i-squared PAC-FP through-hole package. The i-squared PAC-FP, which is the JDEC-approved TO-281 package, is ideal for compact and slim designs such as semi-slim adapters for ultrabooks, notebooks, and netbooks as well as SMPS and lighting solutions. With a body height of 10.85 mm, the i-squared PAC-FP is 30% lower than the current TO-220 FP package. With full insertion at the standoff distance, it offers more insulation between the leads. Step cutting ensures a better creepage, enhancing the linear path between leads and board. By doing away with the upper hole of the TO-220 FP package, the use of a screw is avoided and a clip can be used, which results in more uniform contact pressure and good thermal behavior. The slide shows the side and top views of the different packages. Compared to the TO-220 FP, this fully-molded package is 30% shorter in body height, yet maintains the same level of thermal performance and electrical isolation. The i-squared PAC-FP can be inserted at standoff, saving up to 30% more space and allowing the use of a through-hole package without lead forming, also in a semi-slim adapter. To obtain the same space saving with the TO-220 FP, we have to solder it at the standoff and that would lead to potential stress that could cause defects not only on the interconnect between the leads and package body, but also on the package's internal structure. The damage could be further aggravated by thermal stress resulting from soldering. Operating conditions and failures could appear immediately at final test or may be latent and show up in the field. This slide compares the size and creepage of the different packages when mounted. As we can see, the use of an i-squared PAC-FP package is simpler and reduces cost as the use of screws and a torque screwdriver are not required. By cutting a step in the plastic chassis, creepage is improved by 25%. The performance of the two packages have been tested using the ST-EVAL ISA149-V1 Evaluation Board. That board implements a 75-watt SMPS reference design tailored to the specifications of a typical high-end portable computer power supply adapter. The peculiarities of this design are its very high-end efficiency at light load and excellent global efficiency for a two-stage architecture. In particular, the results for the current benchmark show the same efficiency performance. This slide compares the thermal performance of the two packages. The result is that the difference is less than one degree Celsius. This means that the thermal behavior of the two packages is almost the same. The picture highlights the improved compactness provided by the i-squared PAC-FP package. For further information on the i-squared PAC-FP and our complete portfolio of MOSFETs, please visit www.st.com.