 This research examined the properties of a Bi-AGMG soldering alloy and its ability to join AL-203 ceramics and NICC composites. The solvus melting point ranges from 264°C to 380°C depending on the amount of silver and magnesium present. It forms a bismuth matrix containing segregated silver crystals and an AGMG Bi phase. The average tensile strength of the solder is 26.7 MPa. When joined to AL-203 ceramics, the solder forms a high-MG reaction layer around the interface, which increases the bond strength to 27 MPa. Similarly, when joined to NICC composites, the solder forms a Ni by 3 phase at the interface, increasing the bond strength to 27 MPa as well. This article was authored by Roman Kolnak, Tomas Melis, Yarmor Drapola, and others. We are article.tv, links in the description below.