 This research paper discusses the development of a new type of epoxy resin with disulfide-containing curing agents. These curing agents are added to the polymer network to create flexible polymer segments and disulfide bonds which are then activated at lower temperatures than traditional epoxies. When the resin is exposed to heat, these bonds break apart and reform, allowing the resin to repair itself. This allows for a more durable and long-lasting epoxy coating. This article was authored by Baolai Wang, Zway Li, Qin Ruliu, and others.