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Etch Processes for Microsystems Fabrication - Part II

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Published on Feb 7, 2013

Etch processes Part II covers the basics of dry etch processes and describes several applications of dry etching for microsystems fabrication. Part I of etch processes covers the types of etch and the wet etch processes. This presentation is presented by the Southwest Center for Microsystems Education (SCME). Supporting materials can be downloaded from the SCME website (http://scme-nm.org).

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  1. 6

    Microcantilevers as Biosensors

  2. 7

    Cantilevers and Resonant Frequency

  3. 8

    An Introduction to DNA Microarrays

  4. 9

    DNA Microarray Fabrication

  5. 10

    How Does a DNA Microarray Work?

  6. 11

    Wet Oxidation Process

  7. 12

    Dry Thermal Oxidation Process

  8. 13

    Wet vs. Dry Oxidation Processes

  9. 14

    History of MEMS - An Introduction

  10. 15

    Weights and Measures Part III

  11. 16

    Weights and Measures Part II

  12. 17

    Weights and Measures Part I

  13. 18

    The Workings of the Retinal Prosthesis

  14. 19

    Silicon Crystal Origami

  15. 20

    MEMS Applications Overview

  16. 21

    Comparison of Scale: Macro, Micro, Nano

  17. 22

    Introduction To Transducers - Macro and Micro-size

  18. 23

    Introduction to Sensors - Macro and Micro-size

  19. 24

    Introduction to Actuators - Macro and Micro-size

  20. 25

    Etch Processes for Microsystems - Part I

  21. Etch Processes for Microsystems Fabrication - Part II

  22. 27

    Deposition Overview - Part I

  23. 28

    Deposition Overview - Part II

  24. 29

    Photolithography Overview for MEMS

  25. 30

    LIGA_Micromachining

  26. 31

    Surface Micromachining Overview

  27. 32

    Bulk Micromachining Overview

  28. 33

    MEMS Pressure Sensor Fabrication

  29. 34

    DNA Microarray

  30. 35

    DNA Hybridization

  31. 36

    Hydrophobic MP4.mov

  32. 37

    LIGA Micromachining Process Overview

  33. 38

    Ps_backside_etch_3loops.mov

  34. 39

    MEMS Pressure Sensor Operation

  35. 40

    (100) Crystal Plane of Silicon

  36. 41

    MEMS Cantilevers - Sacrificial Layer Removal

  37. 42

    MEMS Pressure Sensor Backside Etch

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