 We have developed a concept of transfer printing process which allows us to provide some of stick-like thin film sensors or electronics. The industrial-grade thin film devices are typically fabricated on a silicon wafer. Our technology is to remove this thick silicon wafer from the functional thin film devices. Now, these functional devices are sitting on the temporary, releaseable tape such that you can very easily cut off unnecessary parts of the system and then afterwards you can attach this predefined shape of thin film devices onto a specific target surface. Any place of interest such as existing desk, building window, whiteboard, mirrors, etc. One key advantage of this approach is that you can define additional functionality on the surface of existing product without the need of additional manufacturing process.