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Uploaded on Apr 17, 2010
The video shows an automatic assembly of fives silicon microparts of 400 µm x 400 µm x 100 µm on 3-levels. Each microassembly subtask is performed using a pose-based visual control which uses a CAD model-based tracker. The assembly clearance is estimated to 3 µm that allows to obtain solid and complex micro electromechanical structures without any external joining (glue, wending). For more informations, please go to http://www.femto-st.fr/