 Hello, and welcome to this presentation on ST's Power Modules AISPAC family. AISPAC stands for Adaptable Compact Easier Package. Today, ST's Power Transistor Division offers a very complete power products portfolio from discreet to power modules. For different power ranges and applications, ST offers IGBT and MOSFET discreet products with a typical range from 10 to 5 kilowatts, Slim IPM, the intelligent power module product with a typical range from 20 watts to 3 kilowatts, and the new AISPAC power module with a typical range from 3 to 30 kilowatts. This portfolio provides ideal solutions for industrial and robotic drives, home appliances, welding, pumps, fans and blowers, and air conditioning. The AISPAC Adaptable Compact and Easier Package is the best power module offered for industrial motor control applications and more. The key features of this new power module family are technology and flexibility to address market needs, 100% controlled by ST for silicon, silicon carbide, MOSFET, IGBT and diode, current level from 15 to 75 amps for power scalability, and 650 and 1200 volt breakdown voltages. The AISPAC products available in two different form factor packages, AISPAC 1 and AISPAC 2 is available with press fit or solder pins options for the main topologies, 6-PAC and CIB, converter inverter break. In addition to mounting integrated screw clamps for simplified and stable screwing, the packages house a negative thermistor coefficient NTC, giving the customer a compact design and cost effective system approach that also ensures a very high power density. Several different current ratings are available. AISPAC 1 and AISPAC 2 packages can be used for different power ranges depending on the application's internal configuration, 6-PAC or CIB and on the maximum current capabilities. The compact module concept and the high power density facilitate the PCB layout design, ensuring at the same time high reliability and quality levels. The high flexibility of the packages structure allows to house various power switches, IGBT, MOSFET, silicon carbide, diode and SCR on various topologies, from 6-PAC to CIB PIM from three level to triple boost. The nomenclature of these products is very simple and easy to memorize. Each digit refers to a specific characteristic, A1 module type, A1, AISPAC 1, A2, AISPAC 2, P, internal main configuration, T, 12-PAC, P, 6-PAC, three phase full bridge, C, converter inverter break, CIB, H, half bridge, U, three level, TB, triple boost, 25, current indication DC for IGBT, RDS on max for MOSFET, RDS on tip for silicon carbide, S, diode features, S, soft diode, W, silicon carbide diode, 12, breakdown voltage, two digits, value divided by 100 or by 10, M series, H, high speed IGBTs, V, very fast IGBTs, M, low loss IGBTs, S, low VCE sat IGBTs, W, silicon carbide MOSFET, M5, MD mesh 5, FX additional options, F, press fit, C, capacitor inside. The product portfolio in mass production includes AISPAC 1 and AISPAC 2 products for 6-PAC and CIB topologies with breakdown voltages of 650 and 1200 volts and a current capability from 15 to 75 amps. As shown in the slide, the AISPAC assembly structure is very clear and respects all the class technology standards. An evaluation board system has been built in the ST-PRAHA lab to validate the product in a real application and to compare it with the main competitor devices. The first benchmark as shown in this slide is related to the comparison of the turn-off switching energy, E-OFF. As you can see, the ST device offers better turn-off switching energy than our main competitor. The total power losses under different conditions confirm that more power, better efficiency, and a lower junction temperature is possible with the ST module. In application conditions, the module case temperature remains similar for ST and competitor products. Here, a relatively low mechanical power was measured. An ST evaluation board is available for testing with an AC motor. It is fully compatible with the STM32 motor control development ecosystem and can be connected by RS232 and CAN connections. The ST PowerStudio Dynamic Electrothermal Simulation software, dedicated to power devices, is now available. This powerful and very useful PowerStudio simulator enables users to simulate our products and immediately have all necessary information about the performance of our power module's products. The package configurations are very flexible and enable developers to implement different topologies, housing different power switching semiconductors. ST's offer is unique in that we are owners of the semiconductors and packaging aspects. Various support materials are available from ST.com and or upon request. For additional information and the complete list of part numbers belonging to ST's ASPAC products, please visit www.st.com slash ASPAC dash e-press.