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Published on Apr 2, 2012
http://spie.org/al - the world's premier semiconductor lithography conference and exhibition.
DSA is touted as a means for extending optical lithography beyond its current limits, and recent announcements bode well for taking it from the academic lab-scale environment into high-volume manufacturing.
At the 2012 SPIE Advanced Lithography conference, imec (Leuven, Belgium) announced the successful implementation of the first 300mm fab-compatible Directed Self-Assembly (DSA) process line in imec's 300mm cleanroom fab. The upgrade of an academic lab-scale DSA process flow to a fab-compatible flow was realized in collaboration with the University of Wisconsin, AZ Electronic Materials and Tokyo Electron Ltd.
Directed Self-Assembly is gaining momentum as a means for extending optical lithography beyond its current limits. DSA is an alternative patterning technology that enables frequency multiplication through the use of block copolymers. When used in conjunction with an appropriate pre-pattern that directs the orientation for patterning, DSA can reduce the pitch of the final printed structure. Moreover, DSA can be used to repair defects and repair uniformity in the original print.
Kurt Ronse is lithography department director at imec. He received both Master of Science and PhD degrees in Electrical Engineering from the University of Leuven (Belgium). He joined the lithography group in IMEC in 1990, specializing in the field of phase shifting masks, off-axis illumination techniques and CD control optimization.
He has authored and co-authored numerous publications and is a frequent conference speaker, often times presenting invited and plenary papers, in the field of optical lithography (I-line, deep-UV, 193nm, 193nm immersion) and EUVL.
Currently Dr. Ronse holds the position of , where he is responsible for the Advanced Lithography Program covering 193nm immersion, double patterning and EUV lithography. He is a member of SPIE.