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Published on Oct 16, 2014
When it comes to BGA graphics chips with a flip chip design, to reball is IDIOCY - the chip itself is dead on the inside. Heating it up causes it to work again for a temporary period of time before it eventually dies again. You can prove that the problem is not in the balls very simply by heating your chip up to 120c for ten minutes, you will see that it often works again for a short period. 120c cannot melt solder, which is proof that the issue is in the bumps of the chip, NOT the solder balls.
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