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Published on Feb 13, 2017
PLASMOfab aims to develop CMOS compatible plasmonics in a generic planar integration process as the means to consolidate photonic and electronic integration. Wafer scale integration will be used by PLASMOfab to demonstrate low cost, volume manufacturing and high yield of powerful PICs. The new integration technology will unravel a series of innovations with profound benefits of enhanced light-matter interaction enabled by plasmonics in optical transmitters and biosensors modules.
PLASMOfab is a 3-year collaborative project on CMOS-compatible photonic, plasmonic and electronic integration that brings together ten leading academic and research institutes and companies. The project was launched in Januray 2016 and it is is funded by the European Union's Horizon 2020 ICT research and innovation programme under grant agreement No 688166.