China's New Space Exploration Vision Shoots for the Moon | Disco Corporation - Uhta

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DISCO Corporation (株式会社ディスコ ) is a precision tools maker from Japan. The company was founded as Daiichi-Seitosho Co. Ltd. in May 1937, as an industrial abrasive wheels manufacturer.
DISCO Corporation makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
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