A process to make reliable 3D chips developed at EPFL
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Uploaded by epflnews on Jan 24, 2012
Stacked vertically instead of placed side by side, reliable 3D chips were created in EPFL's Microelectronics Systems Laboratory (LSM - http://lsm.epfl.ch). This lab has also developed a high performance manufacturing method. Thanks to this technology, computers will be faster, more efficient and capable of carrying out more tasks simultaneously
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and everything will flow :-)
ivanjesik 3 weeks ago
@maxwell82 thank you
csikjarudi 1 month ago
@csikjarudi Good question. We've been also working on microchannel based liquid cooling for high performance 3D chip stacks. You can check the LSM website and Nano-Tera CMOSAIC project for details.
maxwell82 1 month ago
What about the cooling problem?
csikjarudi 1 month ago
Oh this similar to that 3d printing eh? Tiny tiny sized PCs, low powered preferably... because over powered would burn that thing in two splits, no?
faro0485 1 month ago
great technology guys!
mrdexter86 1 month ago