Singulating a PCB Array with a Semiautomatic Air Press

This is the first test cut singulation of a new Depaneling Die for a 36-up PCA (printed circuit board array). The printed circuit board is being singulated, or depaneled from the array using a die in a semiautomatic air press. This die will normally be used with a robotic load/offload.
The process is stress free to the PCB components and trace lines. Delicate ceramic capacitors can be as close as 1/2 mm of the die blades. The process is a quick and relatively inexpensive method to separate individual PCBs from a PCA. Visit www.pioneerdietecs.com for more information.

Category:

Science & Technology

Tags:

• Singulation
• Singulating
• Depaneling
• Depanelization
• Die Cutting
• Air Press
• Semiautomatic Air Press
• Pneumatic Press
• PCB
• PCA Sharp Edge Blade
• Cutting Die