BrightSpots 3D IC Panel - Part 1: Defining 3D at the Packaging Level and the Circuit Level

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Uploaded by on Jul 19, 2009

In its inaugural BrightSpots series, MCA's BrightSpots 3D IC panel focuses on technology progress and limitations. In part 1out of 5 highlight reels, panelists from EV Group, SEMATECH, Synopsys and Tezzaron Semiconductor share how they define 3D at the packaging level and at the circuit level. Francoise von Trapp, editorial director of 3D InCites is moderating the panel discussion. You can share your viewpoints or simply monitor discussions at www.semineedle.com/MCA3DIC. For more information, visit www.mcapr.com.

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