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BGA Rework Cleaning Reballing & Reflowing Using Lead Solder & Kingbo Flux XModdz

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Uploaded on Jan 15, 2012

Training document http://goo.gl/5ecTw
Updated cleaning procedure http://www.youtube.com/watch?v=3fceVi...

http://xmoddz.com/repair-consulting

kingboflux.com

The Hakko FX 951 http://www.ebay.com/itm/ws/eBayISAPI....

Wide Tip http://www.all-spec.com/products/T15-...

XModdz shows a simple video detailing the process of bga reworking site cleaning and how using the right tools and process guarantees success

BGA rework site cleaning is an important for reflow reball rework. Improper site cleaning can damage pads or lift traces. Using the right flux can greatly aid in bga site cleaning. The old lead free solder must be removed, using lead solder on the soldering tip helps remove the old lead free solder as well as tins the pads for accepting the solder balls. This is an important step, next is cleaning the pads to make sure the site area is flat using XModdz BGA braid this is very easy, the thickness of the braid can absorb tons of solder much better than goot wick or chemwick and with the wide soldering tip only a few swipes is necessary. There are 2 soldering stations sub $400 that we recommend the JBC and the Hakko FX 951. They both allow you to use the wide style tips. Other soldering stations do not have these tips available as they are simply meant to be used for soldering. The JBC and Hako soldering stations have high power that is transferred to the tip to heat up the site enough to clean.

After the left over solder is removed we use BGA site rework cleaning pads to clean up the residue. We tried many different cleaning aids such as cotton balls or cotton swabs which worked but left residue and it took a lot of them to clean. With the BGA site rework cleaning pads combined with alcohol cleaning is a breeze.

After the site is clean the area needs to be totally flat, it should literally be squeaky clean. After this is done you rub kingbo flux on the site and place the chip with careful alignment. There is a 20% error zone for alignment that will be corrected when the solder is liquidous. Basically the chip will align itself onto the pads. This will happen better if using kingbo flux or any other high temp tacky rma flux.

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