BrightSpots 3D IC Panel - Part 5: Heat Issues with Chip Stacking

The panel discussion comes to a close in part 5 of the highlight reels with questions posed by Pete Singer, editorial director of PennWell (e.g., Solid State Technology, Small Times, WaferNews, etc.). Panelists address heat generation issues associated with chip stacking along with thermal dissipation requirements. You can share your viewpoints or simply monitor discussions at www.semineedle.com/MCA3DIC. For more information, visit www.mcapr.com.

Category:

Science & Technology

Tags:

• MCA
• Public Relations
• BrightSpots
• 3D IC
• panel
• EV Group
• SEMATECH
• Synopsys
• Tezzaron
• 3D InCites
• Heat Issues
• Thermal Issues
• Chip Stacking
• Thermal Dissipation
• Test
• Through-silicon Vias
• TSVs
• design tools
• EDA
• semiconductors