3M and IBM to Develop New Types of Adhesives to Create 3D Semiconductors
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Uploaded by jgluckibm on Sep 6, 2011
3M and IBM today announced that the two companies plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon "towers." Processors could be tightly packed with memory and networking, for example, into a "brick" of silicon that would create a computer chip 1,000 times faster than today's fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices. Read the news release: http://www.ibm.com/press/us/en/pressrelease/35358.wss
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Top Comments
All Comments (70)
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@KlingonSpider why do you care no AMD and all these big companies all want money
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READY TO BUILD FLYING SAUCER AND GUNDAM ?
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Well finally I had this idea for a long time.
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wow gluing processors together, I could have told them that...
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good luck cooling that
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GIMME NAO!
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@luisces yep, can only imagine the temperatures inside those intermediate layers. 1000x faster... from zero to charcoal lol :p
4 months ago 5
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I I3 M
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@m4rx05 No my friend, the question is " Does that mean 100 times the heat? "
Be ready for some buuuurning!
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AMD - ADD MORE CORES HURR HURR
IBM - ADD MORE LAYERS HERP DERP
INTEL - ADD MORE CHIPSETS
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AMD: ADD MORE CORES
IBM: ADD MORE LAYERS
INTEL: ADD MORE DIMENSIONS
dingumfCallofDuty 5 months ago 76
IBM and 3M better not leave out AMD on this one. I hate seeing AMD left in the cold all the time. Intel has repeatedly bribed companies to not use AMD based devices, such as dell and sony. I always look out for the underdog and AMD is being targeted all the time. poor little ol' amd :(
KlingonSpider 5 months ago 39