Chemical Mechanical Polishing Systems from Logitech Ltd

This video shows the Tribo and Orbis Chemical Mechanical Polishing (CMP)systems from Logitech Ltd. These systems offer nanometer level material removal capability on either individual die or on wafers up to a maximum 200mm (8") diameter. They can be used with a wide variety of wafer and substrate materials used in device fabrication processes where geometeric precision and surface quality are of paramount importance.

See http://www.logitech.uk.com/cmp-polishing.asp for further details.

Category:

Science & Technology

Tags:

• cmp
• chemical mechanical polishing
• wafer delayering
• planarization
• polishing silicon nitride
• polishing oxides
• polishing polymer layers