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I. Inking a wafer, then unloading it .

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Uploaded by on Oct 20, 2009

I. Inking a wafer, then unloading it . The wafer has previously been tested, and the failed chips has been recorded in a file. This file is used to ink the chips that filed the test. After inking is ready the wafer is put back into the casette (see II.)
Recorded at Sicon Semiconductor AB

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Science & Technology

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  • nice.. i work for Xandex.

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