SEMICON West 2010 - 3800 Die Bonder Demo

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Uploaded by on May 4, 2011

Download the 3800 Die Bonder data sheet: http://www.palomartechnologies.com/palomar-3800-ultra-flexible-die-bonder/
The 3800 Die Bonder is designed for fully automatic, precision microelectronics assembly. The highly-flexible, computer-controlled work cell performs up to three channels of adhesive dispense, component placement, eutectic die attach and flip chip operations over a spacious 35.5" x 20" work area. The 3800 Die Bonder is versatile, powerful and can provide specialized functions in addition to its primary functions.

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