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QFN Rework Process Using Polyimide Stencil ! BEST Inc. www.solder.net !

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Uploaded by on Nov 1, 2010

QFN stenicl bumping process demonstrated using a polyimide stencil. This process is one in which a stencil is used to the bump the bottom terminations of a leadless device making it simple to place without voiding of the the thermal pac or shorting of I/O. BEST instructos make the job seam easy.

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Science & Technology

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  • Are there any stencils for dual row QFN devices? These are much more difficult to solder reliably.

  • @davepusey

    The PCB stencil is consumed using this technique.

  • I love to saw-der.

  • But how do you get the stencil out afterwards?

  • excellent video! thanks for upload

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