QFN stenicl bumping process demonstrated using a polyimide stencil. This process is one in which a stencil is used to the bump the bottom terminations of a leadless device making it simple to place without voiding of the the thermal pac or shorting of I/O. BEST instructos make the job seam easy.
Are there any stencils for dual row QFN devices? These are much more difficult to solder reliably.
kerryexile 1 month ago
@davepusey
The PCB stencil is consumed using this technique.
jameslmorehead 1 year ago
I love to saw-der.
fronkenpoop 1 year ago
But how do you get the stencil out afterwards?
davepusey 1 year ago
excellent video! thanks for upload
djodin 1 year ago