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Low Pressure Molding by Moldman Machines

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Uploaded by on Jul 1, 2008

Simple over-molding process for sealing and protecting electroincs against harsh environment. Replace potting

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Science & Technology

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  • @rohima1234

    Sorry for this very very late reply. Our process is primarily used to encapsulate electronic components and to create effective strain reliefs/grommets on cables. The molding material that we use is a high performance Polyamide (read: fancy hot melt) i.e. we use an adhesive molding materials (brand name is Macromelt). Low Pressure Molding typically replaces potting of electronics.

  • can i use a silicone mold and syringe pressure by hand to make a laptop lid with two part liquid plastic?

    thanks,

    abz

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