Upload

Loading icon Loading...

This video is unavailable.

Decapping ICs (removing epoxy packaging from chips to expose the dies)

Sign in to YouTube

Sign in with your Google Account (YouTube, Google+, Gmail, Orkut, Picasa, or Chrome) to like Applied Science's video.

Sign in to YouTube

Sign in with your Google Account (YouTube, Google+, Gmail, Orkut, Picasa, or Chrome) to dislike Applied Science's video.

Sign in to YouTube

Sign in with your Google Account (YouTube, Google+, Gmail, Orkut, Picasa, or Chrome) to add Applied Science's video to your playlist.

Published on Aug 13, 2012

I thought it would be interesting to try decapping some chips. This involves using fuming nitric acid, which also seemed fun, so I thought I would give it a go. The process starts by milling a precise pocket into the IC using my CNC machine. I used carbide tooling to cut the glass fiber/epoxy material. I then put a drop or two of the acid into the pocket, and raised the temperature to about 100*C. The acid dissolves the epoxy packaging as it sort of "dries". I added more acid to the pocket every few minutes. After about 10 minutes, I washed the IC in acetone, then reapplied acid if there was still material left on the die. Eventually, it was all cleared away, and I had a nice decapped IC.

Loading icon Loading...

Loading icon Loading...

Loading icon Loading...

The interactive transcript could not be loaded.

Loading icon Loading...

Loading icon Loading...

Ratings have been disabled for this video.
Rating is available when the video has been rented.
This feature is not available right now. Please try again later.

Loading icon Loading...

Loading...
Working...
to add this to Watch Later

Add to