BrightSpots 3D IC Panel - Part 4: 3D vs. Traditional Scaling

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Uploaded by on Jul 19, 2009

This portion of the discussion, part 4, focuses on the move to 3D vs. continuing to scale traditionally. Ric Borges of Synopsys, Bob Patti of Tezzaron Semiconductor and Sitaram Arkulgud of SEMATECH weigh in with cost cited as primary driver in the long run. You can share your viewpoints or simply monitor discussions at www.semineedle.com/MCA3DIC. For more information, visit www.mcapr.com.

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