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How Thermal Compound Spreads (MX-2 Edition)

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Uploaded by on Mar 27, 2009

Not sure which method to apply? Watch how the compound spreads under the heatsink!

Part 1 Video (more methods): http://www.youtube.com/watch?v=EyXLu1Ms-q4

My theory on why spread method may not be the best: http://img.photobucket.com/albums/v176/NYC84/Forum/cbf792db.jpg

It is not necessary to cover the whole CPU/heat spreader. Because most of the heat is concentrated around the core area which is at the center. Hence the center of the CPU is more important.

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  • This video makes all the methods look like shit......so whats the right way to apply? lol

  • Oo the air bubbles come from the bending of the plexi glass surface because you push it down at the corners!

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  • @18iser lol The cores are in the middle.

  • @18iser yes they are... i.imgur com/7EGJ4.jpg

  • @staphinfection I have quadcore cpu and the chip(s) are not at the middle bro

  • @summerville22432 the best method really depends on what cpu you have

  • Also, why are you twisting.... you don't need to do that, and if anything it opens the door for uneven spreading and air bubbles or other mistakes... Just use a pea dot right in the center, and firmly place your heatsink down straight and neat. While securing it, you will move it slightly anyway and that will do the same effect you're doing anyway except not to the degree you're doing it.

  • The CHIP is right in the CENTER of the CPU, so the pea method is the ONLY method you should ever use. Spreading is retarded and prone to bubbles, mistakes, and makes a mess. Pea method spreads evenly and covers the most important part THE CENTER of the CPU where all the heat will be generated anyway. Don't be a fool, don't spread.

  • A tip Arctic Silver 5 doesn't spread so easily as MX2. Could you make a video like this using Arctic Silver 5? I think you used Arctic Silver 3 in the other video..

  • @summerville22432 This is about as accurate as I've seen aside from my own calculations. For a .003" (.076 mm) thick layer to be produced that covers most of the CPU cap, a sphere with a diameter of .204" (5.2 mm) needs to be applied to the center. I'm sure there are plenty of variables in there that I didn't account for, but I'm glad to know I got very close to IC's recommendation =)

  • @srwilli4m 2nd (pea) method. It's perfect...

  • smiley method pwns all :)

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