The LPKF MicroLine 6000 P is a laser system for cutting coverlayers, flexible printed circuits (FPCs) and printed circuit boards (PCBs) with high performance and low costs. With its depth-controlled cutting it is able to perform half-cut operations e.g. for decap applications of rigid-flex PCBs.
More application examples are: drilling of microvias in HDI circuit boards (high density interconnect circuit boards), structuring of TCO and ITO, laser removal of tin-resist, drilling of flex material, opening of solder-resist, as well as laser repair and rework of bare and assembled printed circuit boards.
More information:
http://www.lpkf.com/products/pcb-processing/index.htm?utm_source=youtube.com&...
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