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Reflow Process Inspection (RPI)

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Uploaded by on Jun 1, 2009

Unlike SPI and AOI that are defect inspection systems specifically designed for viewing solder deposition and component assembly respectively, RPI complements these systems by inspecting the performance of the thermal process IN-LINE. RPI inspects the thermal process for any joint, including those that are not visible to the AOI system such as BGA components.

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