3D Packaging: Package on Package Technology

The electronics industry is continually developing new and advanced manufacturing processes as products become more complex. One such electronics manufacturing technology is called 3D Packaging. Traditional circuit board manufacturing consists of placing singular electronic components on a bare printed wiring board (PWB). The concept of 3D Packaging is to grow circuit boards upward rather than outward. One emerging 3D Packaging technology is called Package on Package technology (PoP). PoP places electronic components on top of one another into stacks on the PWB. PoP enables smaller, lighter circuit board assemblies with more complex capabilities.

The Navy ManTech Power Packaging Lab -- located within ACI Technologies in Philadelphia, Pennsylvania -- was designed to provide advanced packaging and electronics manufacturing capabilities such as die attach and wire bonding. The Power Packaging Lab is part of the Navy's National Center of Excellence in Electronics Manufacturing: The EMPF (Electronics Manufacturing Productivity Facility). The Power Packaging Lab also has Package on Package capabilities and is equipped to handle small production runs, prototype builds, and process development work.

Category:

Science & Technology

Tags:

• technology
• electronics
• computers
• package on package technology
• 3D Packaging
• ACI
• B2PCOE
• EMPF
• Navy ManTech
• ONR
• integrated circuit design
• package on package
• chip packaging
• circuit design
• flip chip
• flip chip packaging
• packaging design
• Datacon