Mixed Solder Alloy Wetting for SAC BGA Assembly Using Sn63 Solder Paste: INDIUM CORPORATION

This video depicts the dissolution of a SAC (SnAgCu) solder sphere into molten Sn63 solder, at 208°C (below the melting temperature of the SAC alloy sphere).

The purpose of this research is to demonstrate that BGA assembly (using these materials) can be effected at temperatures BELOW standard Pb-free reflow temperatures (~245°C).

We are not suggesting that all BGA attachment be done at 208C. Rather we are demonstrating that going all the way up to 245C is not always required.

Learn more on this exact topic at Mario Scalzo's SMT blog:

http://www.indium.com/blogs/Mario-Scalzo-Blog/Mixed-Alloy-Wetting-for-SAC-BGA...

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[d9andy992]

what is the difference between induim silver and normal 99.9% silver, can someone plse tell me?