Crack An Atom

Inside the Ultra Mobiity workspace with Uday Keshavdas, who's prepping for the Intel Developer Forum in Shanghai April 2-3, 2008. He shows Mobile Internet Devices, including one that he cracks open to show where the new Intel Atom processor fits.

Category:

Science & Technology

Tags:

• idf2008
• idfshangia08
• intel
• mid
• atom
• centrino
• mobility
• mobile
• devices

[2fast4uspartan]

hey, indians in america who are brought up there do so he is not the only one. Asshole

[jamesucla]

Those havent even come out yet and they already look dated.

[scholzie]

a very precise saw cuts the dies out. The wafer is coated with a plastic layer, and the saw cuts between the dies, but not through the plastic. You are left with a sheet of processors which can then be removed one at a time and packaged.

[CrazyMateFTW]

erm... die? 1 in 4 xbox 360s will eventually get the RROD.... loads of my mates have had it so just stfu fan boy...

[MastercheifFTW]

FCuK YoU FaG! XbOx NvR BrEaKs RrOd Is ConSpEReAcY!!!! FAG

[CrazyMateFTW]

im a massive fan of 360 and I know that PS3 is better than 360 for 2 main reason that i like:

1. PS3 has been built a lot better than the 360

2. PS3 Network is free :D

[80corecpu]

I mean processors dies are square shaped aren't they??/How do they cut processor dies out of the circumference of the circular silicon wafer??

[Fran547]

ON STANDBY MODE XD HAHAHAAH FAIL MORE

[MastercheifFTW]

I know the Ps3 is WorSe DaN De XbOx ThrEe SiXtY

[cheiqar]

It has to do with the fabrication of the silicon wafers and how the silicon agglomerates cylindrically

[computergasm]

no, you know jack shit.

[MastercheifFTW]

i know more than you know ps3 LuVeR