Palomar Technologies Model 3500-III performs fully automatic wafer scale packaging and advanced microelectronics assembly. This is a highly flexible system that can perform up to 3 channels of adhesive dispense, and operations such as component placement, eutectic die attach (steady state and pulse heat eutectic bonding), flip chip all over a 710 sq in work area.
the angle is sh1ty....
Emeengor 4 months ago
diffrent types of collets wow.
stormryder23 1 year ago
very good ...some more the m/c provided not just only 1 tool...multi tools too
stevenkoong 2 years ago