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Die Bonder - Wafer Scale Packaging

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Uploaded by on May 20, 2009

Palomar Technologies Model 3500-III performs fully automatic wafer scale packaging and advanced microelectronics assembly. This is a highly flexible system that can perform up to 3 channels of adhesive dispense, and operations such as component placement, eutectic die attach (steady state and pulse heat eutectic bonding), flip chip all over a 710 sq in work area.

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  • the angle is sh1ty.... 

  • diffrent types of collets wow.

  • very good ...some more the m/c provided not just only 1 tool...multi tools too

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