Professional Drag Soldering: J-Lead PLCC
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@jkgamm041 BGA is a very unreliable mount as well but used in mass production because it's easier to automate the soldering process with some slight space saving. Most of the problematic parts of boards I work on are BGA where the RoHS no-lead solder balls have micro fractured. I do reballing but I prefer not to have to mess with BGA. I would agree and say that maybe 10% is BGA mount on a typical board.
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exelente! que tipo de pasta se recomienda para este tipo de soldado ;yo tengo uno pero no solda tan limpio como el video
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exelente !! que tipo de pasta se usaria para soldar?
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@jkgamm041 I agree, not everything is BGA, I work at an aerospace lab as a student, we do a lot of board fabrication (using reflow oven mostly) for populating boards. Lot of surface mount IC's used, why I'm watching this video, this is a priceless skill to have. Great vid by the way!
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The liquid being applied is flux. It removes oxides, prevents re-oxidation and reduces the surface tension of the solder which promotes rapid wetting and a metallurgical bond.
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@mesoderma23 i think it's flux, flux helps get rid of and prevent oxidation of the metal being soldered
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I love the way the solder bridges just melt away.
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Someone knows how much the temperature's iron is? And the brand/kind of the solder??
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Ancient packages. Nowadays everything is a BGA.
heroineworshipper 2 months ago
@heroineworshipper
If they were ancient then the industry would not manufacture with them daily, as they do. I assure you that not everything is BGA. You have BGA, micro BGA, Pin Grid Array, Land Grid Array just as we commonly have a PLCC J-Lead (video), QFP's, SOIC's and more. I was the IPC training director at General Dynamics. Our Defense and aerospace applications had grid array just as many do but the majority in fact are not BGA components.
jkgamm041 2 months ago