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IBM Self Assembly Technology Creates Airgap Microprocessors

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Uploaded by on May 3, 2007

IBM is applying a breakthrough self-assembling nanotechnology to conventional chip manufacturing, borrowing a process from nature to build the next generation computer chips.

The natural pattern-creating process that forms seashells, snowflakes, and enamel on teeth has been harnessed by IBM to form trillions of holes that are used to create insulating vacuums around the miles of nano-scale wires packed next to each other inside computer chips.

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  • I am very excited to see this on youtube. I have a research assistantship in a lab at UMASS that works specifically on the PS-PMMA diblock copolymer... very exciting indeed

  • "Computers in the future may have only 1,000 vacuum tubes and perhaps only weigh 1.5 tons" - Popular Mechanics, 1949

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  • Can someone explain to me why im hearing so much about all of IBMs breakthroughs in technology but not seeing any of their products at a consumer grade? Are they partenered with intel to bring this technology to retail? Or is ibm mainly on their own level only developing technology for industries and servers etc..

  • Air conducts heat by thermo kinetic collisions. There is no conductive heat loss is a vacuum , only radiant energy can traverse a vacuum. Smart

  • i think they find a vaccume as a better insulator because if you think about it there isnt anything to heat up like your air has molicules that will become heated as it runs while the vaccum the heat has to "jump" to the adjacent object

  • @DarkKnight388 High voltage can jump through gap in vacuum then in air,like vacuum tube for example.

  • Uhm, how can air be a better insulator than vaccuum?

  • aaaaaahhhhh?

  • As I know air is batter than vaccume as a insulator,why use vaccume instead of air or others? dont answer me because of HF interference.

  • clever approach to capacitance modulation

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